Eliyan logo

Eliyan

Emerging

Eliyan develops NuLink chiplet interconnect technology enabling die-to-die communication without costly silicon interposers; raised $40M Series A in 2023; founded by Raja Koduri (former Intel) and Ramin Farjadrad;

Best for: Chiplet Interconnect & Advanced Packaging IPEmerging, rapid growth
Semiconductors & HardwareChiplet Interconnect & Advanced Packaging IPWebsiteUpdated May 2026

Company Overview

About Eliyan

Eliyan is a semiconductor intellectual property company founded in 2022 and headquartered in Santa Clara, California, developing chiplet interconnect technology that enables high-bandwidth, energy-efficient die-to-die communication without requiring expensive silicon interposers. The company was founded by Raja Koduri, the former Chief Architect of Intel and head of Intel's Xe GPU program, and Ramin Farjadrad, a serial entrepreneur and interconnect technology expert who previously founded Aquantia. Eliyan's founding team brings deep expertise in high-speed SerDes, packaging, and chip architecture.

Business Model & Competitive Advantage

The company's core product is NuLink, a proprietary die-to-die interface technology based on the UCIe (Universal Chiplet Interconnect Express) standard. NuLink allows chipmakers to achieve interposer-class bandwidth and latency using standard organic substrates — the same packaging materials used in conventional chips — at a fraction of the cost of silicon interposers or 3D stacking technologies like TSMC's CoWoS. This dramatically reduces the barrier to chiplet-based design by eliminating the need for specialized and supply-constrained interposer fabrication capacity. Eliyan raised a $40M Series A in 2023, with investors including Maverick Silicon, Mithril Capital, and strategic semiconductor industry backers.

Competitive Landscape 2025–2026

Eliyan's technology is directly relevant to the AI chip boom: large AI accelerators like those from NVIDIA, AMD, and custom ASIC vendors are increasingly built as multi-die chiplet assemblies, and high-bandwidth die-to-die interconnect is a critical bottleneck. By providing chiplet interconnect IP that is cost-effective, power-efficient, and manufacturable on standard substrates, Eliyan enables a broader ecosystem of chipmakers — including hyperscaler custom silicon teams and fabless AI chip startups — to adopt chiplet design without the cost and supply chain complexity of interposer-based packaging.

Founded
2022
Headquarters
Santa Clara, California
Curated content • Fact-checked and verified

Key Differentiators

Emerging Innovator

Eliyan is an emerging player bringing innovative solutions to the Semiconductors & Hardware market.

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