Halo Industries logo

Halo Industries

Emerging

Halo Industries develops laser-based hardware systems for semiconductor wafer dicing and materials processing in solar, power electronics, and semiconductor manufacturing; raised $70M+ total;

Best for: Laser-Based Wafer Dicing & Materials Processing SystemsEmerging, rapid growth
Semiconductors & HardwareLaser-Based Wafer Dicing & Materials Processing SystemsWebsiteUpdated May 2026

Company Overview

About Halo Industries

Halo Industries is a deep-tech hardware company founded in 2015 and headquartered in Santa Clara, California. The company develops laser-based systems for precision materials processing, with a primary focus on semiconductor wafer dicing — the critical manufacturing step that separates individual chips (dies) from a processed wafer. Traditional wafer dicing uses mechanical diamond blade saws, which generate significant kerf loss (wasted silicon), cause microcracks that reduce die strength, and limit minimum die spacing. Halo's proprietary laser dicing technology uses ultra-fast laser pulses to cleave wafers with near-zero kerf loss, higher die yield per wafer, improved die edge quality, and the ability to dice thinner wafers than blade methods allow.

Business Model & Competitive Advantage

The company has raised over $70M in total funding and counts among its customers manufacturers in the solar cell, power semiconductor (SiC and GaN devices), and mainstream silicon semiconductor industries. Its technology is particularly relevant for compound semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) — materials used in EV power electronics and 5G infrastructure — where traditional blade dicing is especially challenging due to material hardness. Halo's laser systems enable manufacturers to improve the economics of SiC and GaN production, which is a critical bottleneck as EV adoption drives demand for power semiconductors.

Competitive Landscape 2025–2026

Halo Industries competes with established laser systems companies including Disco Corporation (Japan's dominant wafer dicing equipment provider) and Coherent (formerly II-VI). Its competitive edge lies in its specific laser process innovation for hard compound semiconductor materials, rather than competing head-to-head across all dicing applications. The company is positioned at the intersection of semiconductor manufacturing equipment and the clean energy transition, where SiC power device demand is surging.

Founded
2015
Headquarters
Santa Clara, California
Curated content • Fact-checked and verified

Key Differentiators

Emerging Innovator

Halo Industries is an emerging player bringing innovative solutions to the Semiconductors & Hardware market.

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