Ferveret vs Cursor

About

Ferveret is a data center cooling technology company developing two-phase immersion cooling systems based on subcooled nucleate boiling — a heat transfer mechanism inspired by nuclear reactor cooling methods that achieves extremely high heat flux removal capability, enabling cooling of next-generation AI accelerators and high-performance computing chips that air cooling and single-phase liquid cooling cannot adequately handle. Founded in 2021, Ferveret raised $2.1 million from Y Combinator and E14 Fund, achieving $1 million in revenue in 2024 and successfully delivering its first 4 MW cooling contract from its El Paso, Texas manufacturing facility.\n\nFerveret's two-phase immersion approach works by submerging computing hardware in a dielectric fluid — when the chips generate heat, the fluid boils at precisely controlled temperatures, carrying heat away as vapor (the phase change enables far more heat transfer than single-phase liquid cooling). The subcooled nucleate boiling technology optimizes the boiling conditions for maximum heat transfer efficiency at controlled temperatures, enabling cooling of 300-1000W+ per chip that modern AI training accelerators (H100, B200) require. This approach addresses the fundamental limit that air cooling reaches at approximately 50W/chip.\n\nIn 2025, Ferveret competes in the data center thermal management market with GRC (Green Revolution Cooling, immersion cooling leader), LiquidStack, Submer, and traditional CRAC/CRAH air cooling for high-density AI compute installations. The data center cooling market has grown dramatically as AI training and inference workloads drive GPU density requirements beyond what air-cooled facilities can handle — NVIDIA H100 and B200 cards require 700W-1000W each, and the data centers being built for AI in 2024-2026 are designed for 40-80kW per rack, impossible with air. The successful 4MW delivery validates Ferveret's manufacturing capability. The 2025 strategy focuses on growing AI data center contracts with hyperscalers and colocation providers, scaling manufacturing capacity, and improving system density and heat reuse efficiency.