# Amkor Technology

**Source:** https://geo.sig.ai/brands/amkor-technology  
**Vertical:** Semiconductors  
**Subcategory:** Advanced Packaging  
**Tier:** Leader  
**Website:** amkor.com  
**Last Updated:** 2026-04-14

## Summary

Amkor Technology (AMKR) reported $6.1B revenue in FY2024, down 4% YoY. World's #2 semiconductor packaging and test company. Critical for AI chip advanced packaging. HQ: Tempe, AZ.

## Company Overview

Amkor Technology, Inc. is the world's second-largest provider of outsourced semiconductor assembly and test (OSAT) services, headquartered in Tempe, Arizona. Founded in 1968 by Kim Joo-jin in South Korea, Amkor packages and tests semiconductors for fabless chip designers who outsource manufacturing to foundries (TSMC, GlobalFoundries) but need their chips assembled into final packages before use. The company reported revenues of $6.1B in FY2024, down approximately 4% year-over-year due to soft consumer electronics demand.

Amkor's services span advanced package types including flip chip BGA, wafer-level packaging (WLP), panel-level packaging, 2.5D interposer packages (for AI chips), and 3D stacking (HBM integration). The company's advanced packaging capabilities are increasingly critical for AI: NVIDIA's H100/H200 GPUs and Blackwell architecture use CoWoS (chip-on-wafer-on-substrate) packaging that integrates HBM3 memory directly onto the GPU die — a process that relies on Amkor and ASE for outsourced packaging steps. As AI chips grow more complex and power-dense, advanced packaging is becoming a key differentiator.

Amkor operates 27 manufacturing facilities across Asia (Korea, Taiwan, China, Japan, Malaysia, Vietnam, Philippines) and one new facility under construction in Peoria, Arizona — part of CHIPS Act investments to bring semiconductor packaging to the US. Amkor trades on NASDAQ (AMKR) with a market cap of approximately $5–6B. It competes primarily with ASE Technology Holding (the world's #1 OSAT), JCET Group, and Powertech Technology.

## Frequently Asked Questions

### What is Amkor Technology's annual revenue?
Amkor Technology reported $6.1B in revenue for FY2024, down approximately 4% year-over-year due to soft consumer electronics demand. Advanced packaging for AI chips is a growing offset to the consumer decline.

### What does Amkor Technology do?
Amkor packages and tests semiconductors — it takes bare chips from fabs and assembles them into final packages (with substrates, bonding wires, or advanced 2.5D/3D integration) that can be mounted on circuit boards.

### What is Amkor's stock ticker?
Amkor Technology trades on NASDAQ under ticker AMKR. It is a component of the S&P 500.

### How does Amkor relate to AI chip manufacturing?
Advanced AI chips like NVIDIA's H100/H200 require complex packaging that integrates multiple chiplets and HBM memory using 2.5D and 3D packaging techniques. Amkor's advanced packaging capabilities make it a critical part of the AI semiconductor supply chain.

### Who are Amkor's main competitors?
Amkor's primary competitor is ASE Technology Holding (the world's largest OSAT, Taiwan), followed by JCET Group (China), Powertech Technology, and STATS ChipPAC. TSMC also offers advanced packaging internally (CoWoS, SoIC).

### What is OSAT and why do fabless chip designers outsource semiconductor assembly and test?
OSAT (Outsourced Semiconductor Assembly and Test) providers like Amkor take bare semiconductor die from wafer fabs (TSMC, GlobalFoundries) and package them into final chip forms — encapsulating the die in protective material, connecting bond wires or solder bumps to a lead frame or substrate, and running electrical tests to verify functionality before shipping to customers. Fabless chip designers (Qualcomm, AMD, Apple, Nvidia) outsource packaging because building and operating advanced packaging facilities is capital-intensive and requires specialized expertise that chip designers prefer not to own — focusing their capital on chip design and fab relationship management instead.

### What advanced packaging technologies does Amkor offer for AI chips and HBM integration?
Amkor offers advanced packaging technologies including flip chip BGA (FC-BGA) for high-performance processors, wafer-level packaging (WLP and FO-WLP) for mobile SoCs, 2.5D interposer packages (SWIFT and SLIM) that connect multiple chips on a silicon interposer for AI accelerators requiring large die sizes, and 3D stacking for memory integration. The demand for advanced packaging is driven by AI accelerators — Nvidia H100 and AMD MI300X require sophisticated CoWoS-style 2.5D packaging to integrate HBM memory with GPU compute die. Amkor competes with ASE Group and TSMC's own advanced packaging services (CoWoS, SoIC) for this high-value AI chip packaging business.

### How is Amkor expanding geographically to serve US and European chip manufacturing onshoring?
Amkor is investing $2+ billion to build an advanced semiconductor packaging facility in Peoria, Arizona — announced in 2022 as part of US semiconductor supply chain diversification driven by the CHIPS Act and concerns about Taiwan concentration risk in both wafer fabrication and packaging. The Arizona facility is designed to package advanced chips manufactured at TSMC's nearby Phoenix fab, creating a complete US-based chip manufacturing and packaging cluster for the first time. Amkor also has manufacturing in South Korea, Portugal, Malaysia, Philippines, and Japan, giving it geographic diversification across the key semiconductor manufacturing regions.

## Tags

hardware, manufacturing, public, b2b

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*Data from geo.sig.ai Brand Intelligence Database. Updated 2026-04-14.*